Eighty-year-old Japanese firm may be key to next-gen chip tech. ONE Japanese company that got its start making grinding wheels for machinery …

Both "Cross-edge" technology and quality assurance system make it possible to realize the highly-reliable silicon products. We continue to supply silicon parts which can meet the technological innovation our customers are handling.

Wheels. By changing from a vitrified bond (VS, VS202, etc), which has been used for rough grinding on Z1-axis, to a resin bond BT100 (Photo 4), it is possible to lower damage and suppress edge chipping *1, which is a cause of wafer breakage.Furthermore, by employing aZ2-axis wheel with BK-09 bond, which supports a larger removal of Z1-axis grinding damage, it is possible to achieve thin ...

- TAIKO, developed by DISCO Corporation, is a wafer back grinding process that uses a new grinding method. It is used for reducing the risk of thin wafer handling and lowering the warpage. The grinding process in TAIKO leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference.

Areas of expertise focus on the front end silicon wafer manufacturing process such as: Metrology equipment dealing with wafer flatness measurement, edge profile measurement, wafer thickness, resistivity measurement, sorting, and wafer lifetime measurement. Contact us, call us toll-free in the USA at 888-324-8766 to learn more!

The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders "W-GM series" process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials.

Dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process. Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible!

Without back grinding, the cross section of the wafer edge is round shape. However, the cross section edge of the back grinded wafer is sharp like a knife tip. The edge of the wafers is extremely fragile. Take care when handling, storing in containers, and the transportation inside the machine.

Best Japanese Kitchen Gadgets for Mixing and Grinding. Japanese Suribachi and Surikogi, or mortar and pestle, is an indispensable part of the kitchen. It is used in a variety of ways, for recipes that involve grinding and mixing. In Japan, Suribachi and Surikogi are most commonly used to grind sesame seeds.

Item # MAGKIT. $62.31 $49.99. DMT Diafold® Magna-Guide™ Kit with EE/E/F/C in Case. Item # MAGKIT-4. $96.95 $79.99. DMT Diafold® Magna-Guide™ Sharpening Accessory Kit. Item # MGUIDE. $23.99 $20.99. GATCO Edgemate Professional Knife Sharpening System.

• Silicon is the seventh-most abundant element in the universe ... and Grinding 5. Slicing 6. Edge Rounding 7. Lapping 8. Etching(Chemical Polishing) 9. Polishing 10. Cleaning 11. Inspection 12. Packing / Shipping ... Test Equipment Bin 1: Good Quality Devices

(Bloomberg) -- One Japanese company that got its start making grinding wheels for machinery more than 80 years ago believes it holds the key to …

Fujimi Corporation 11200 SW Leveton Drive, Tualatin, Oregon 97062 Ph. (503) 682.7822 Fax. (503) 612.9721 Get Directions >

Grindng & Polishing Supplies. We carry full line of high quality grinding & polishing supplies. Silicon Carbide Grit. Polishing Powders. Polishing Bars. Polishing Media. Polishing Pads. Diamond Powder.

17,145.95 Cr. 18.98 Cr. Carborundum Universal Limited (CUMI) was founded in 1954 as a tripartite collaboration between the Murugappa Group, The Carborundum Co., USA and the Universal Grinding Wheel Co. Ltd., U.K. With state-of-the art facilities and strategic alliances with global partners, CUMI has achieved a reputation for quality and innovation.

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tomatic grinding, which could be important when the cross section at a specific depth is of interest. Automatic equipment is much more expensive than manual machines. Diamond abrasives are recommended for grinding most ceramics, but silicon carbide (SiC) paper and cubic boron nitride (CBN) platens can also be used.

Wafer Handling and Processing for Semiconductor Automation. High-quality processing equipment for semiconductive materials, including PV, are made by Daitron. We have been in the industry for over 25 years, providing high-precision equipment from ingot processing to final inspection. Processes Daitron can contribute to are as follows: slurry ...

Sekiya's grandfather founded the company in 1937 to cash in on demand for grinding equipment amid Japan's pre-war military buildup. After the war, Disco's abrasive wheels found use in ...

US5658189A US08/527,348 US52734895A US5658189A US 5658189 A US5658189 A US 5658189A US 52734895 A US52734895 A US 52734895A US 5658189 A US5658189 A US 5658189A Authority US United States Prior art keywords wafer grinding polishing grinding wheel edge Prior art date Legal status (The legal status is an assumption and is not a legal conclusion.

[ Head Office ／ Annaka factory ] 2993 Gobara,Annaka,Gunma,379-0315 JAPAN. TEL:027-385-5800 FAX:027-385-5880

This paper presents a new grinding method in which a silicon wafer rotating at high speed is ground by a cup wheel that is fed inward continuously. The paper compares experimental results by this ...

Grinding; Lapping (1 or 2 steps) Polish and Chemical-Mechanical Polishing (CMP) Silicon Carbide Wafer Grinding. The EVG-250/300 series Vertical Grinding Machine combined with Engis MAD Grinding Wheels can achieve a superior surface finish on silicon carbide wafers to reduce or even eliminate loose abrasive lapping steps.

Grinding and Polishing Equipment. A complete range of machines, accessories, and consumables is available for mechanical preparation, ranging from manual systems for the occasional sample to powerful and fully automatic preparation solutions for high-volume processing.

(Bloomberg) -- One Japanese company that got its start making grinding wheels for machinery more than 80 years ago believes it holds the key to helping manufacturers create ever slimmer and more powerful semiconductors to power next-generation …

DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions. The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge ...

Master Fluid Solutions (Master Chemical Corporation) Perrysburg Ohio, providing industrial coolants, metalworking fluids, cutting fluids, grinding fluids, milling fluids, cutting oils, concentrated washing compounds, cleaning compounds and rust preventatives all under the Trim® trademark

Sekiya's grandfather founded the company in 1937 to cash in on demand for grinding equipment amid Japan's pre-war military build-up. After the war, Disco's abrasive wheels found use in ...

US8309464B2 US12/415,551 US41555109A US8309464B2 US 8309464 B2 US8309464 B2 US 8309464B2 US 41555109 A US41555109 A US 41555109A US 8309464 B2 US8309464 B2 US 8309464B2 Authority US United States Prior art keywords wafer edge peripheral edge etchant point Prior art date Legal status (The legal status is an assumption and is not a legal conclusion.

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TOP. Introducing the Edge Grinder series that brings NC-controlled grinding to the chamfering process on silicon and other wafers for the first time in the world. Besides the WBM series, in wide use and still regarded as the industry standard, we will be releasing the …

A grinding wheel's durability comes from its bonded construction. 3M Grinding Wheels are built by bonding abrasive grain together with resin to create a hard, durable wheel. This construction makes an abrasive wheel that lasts longer than other metal grinding solutions like flap discs and fibre discs, reducing the amount of time spent ...

In small diamter wafering process, wafers are sliced one by one from the ingot using a rotating diamond inner peripheral blade. The image shown on left is slicing with wire-saw. Beveling (Peripheral Rounding) The periphery of a wafer is ground with a diamond tool to attain the required product diameter.